Help you fully understand Calterah

What are the technological advantages of Calterah CMOS mmWave radar SoCs?

The core technological advantages of Calterah CMOS mmWave radar SoCs are:

  • High integration
  • CMOS process that enables mass production with low cost
  • Innovative Antenna-in-Package (AiP) design

How to understand the advantage of high integration of Calterah mmWave radar chips? What are the benefits of high integration?

Different from traditional mmWave radar transceivers, Calterah's mass-produced mmWave radar chips are based on the CMOS process for realizing the system-on-chip (SoC) design. Each chip device basically integrates all the components required by a radar system, including RF front-end, analog baseband, radar signal processing accelerator, high-performance processors, and communication interfaces, with outstanding advantages in Power, Performance, and Area (PPA). The highly-integrated Calterah SoCs greatly simplify the design of radar modules and lower the cost of radar systems.

After purchasing Calterah mmWave SoCs, what technical resources and support will Calterah offer?

Calterah offers a set of complete solutions covering all scenarios to help customers shorten the time to market:

  • Software and hardware reference designs: Calterah offers easy-to-use software and hardware reference designs, covering intelligent driving, indoor sensing, and many other radar applications, so as to shorten the product development cycles of customers;
  • Complete radar signal processing SDK: Calterah offers comprehensive SDKs to advance the software development of radar applications;
  • Antenna design support: Calterah offers professional guidance and support in antenna design;
  • Responsive field application engineering (FAE) support: Calterah's professional FAE team offers you reliable technical support and field services.

What is the AiP technology? What are its advantages in practical application?

AiP is short for Antenna in Package. Different from traditional independent antennas, the AiP technology from Calterah integrates antennas into the package substrates or structures of chips, realizing the integration of SoC and RF signal transmission and receiving. Compared against chips with standard packages, the mmWave radar SoCs with AiP can further enhance the integration of radar modules and reduce their sizes and cost. Furthermore, AiP allows high consistency and precision of antenna production without external connection or radiation loss, and lowers the design threshold.

Calterah is a world-leading enterprise in the mass production of mmWave radar SoCs with AiP. Over the years, Calterah has been continuously optimizing the AiP technology. Currently, Calterah radar SoCs with AiP have been widely applied in automotive scenarios with strict installation requirements, such as door radar and in-cabin radar, as well as in smart home, elderly care, and other industrial and consumer fields. 

What is the RoP® technology? What are its advantages in practical application?

RoP® is short for Radiator on Package, the most advanced and innovative mmWave packaging technology of Calterah. This technology directly transmits signals to the waveguide antenna system through radiators, significantly reducing antenna feedline loss and enhancing channel isolation, thereby achieving great performance improvement.

Currently, Calterah's RoP® technology is applied to the Alps-Pro and Andes SoCs. Working with the waveguide antenna system, the SoCs with RoP® significantly enhance the detection performance and angular resolution capability of radar, facilitating the realization of high-performance radar for intelligent driving.

What applications can Calterah chips achieve? And what certifications does Calterah have?

Calterah mmWave radar SoCs are used in automotive, industrial, and consumer electronics markets, with automotive-grade chips widely applied in Advanced Driver Assistance Systems (ADAS) and autonomous driving, such as corner radar, forward-looking radar, imaging radar, in-cabin radar, door radar, etc.

Calterah has established a comprehensive management system covering the full lifecycle of SoCs, by attaining the ISO 9001 Quality Management Certification, ISO 26262 Functional Safety Management Certification, ISO/SAE 21434 Cybersecurity Management Certification, ASPICE CL2 Certification, ISO 27001 Information Security Management Certification, and TISAX AL3 label.

Calterah automotive-grade SoCs meet the reliability requirements of AEC-Q100, and the SoC products reach the ASIL-B level of Functional Safety.

What capabilities does Calterah have in terms of mass production testing?

The mass production of high-frequency automotive-grade chips requires reliable and cost-effective automated testing. Traditional automatic test equipment available on the market was only suitable for low-frequency chips. For high-frequency mmWave chips, Calterah boasts mass production testing solutions developed in-house from scratch, including customized and complete high-frequency mmWave chip testing hardware, building high-precision over-the-air test chambers for AiP chip testing, and establishing the Calterah ATE clean lab—J Lab to further develop testing programs.

Calterah's R&D investment and results in the mass production testing solutions for high-frequency mmWave chips, have also helped enrich the technical capabilities of China's automotive chip supply chain in the high-frequency chip testing.

How to tell a Calterah automotive radar SoC from an industrial one by their part numbers?

The suffixes in the Calterah SoC part numbers can help you distinguish automotive-grade chips from industrial-grade ones.

An SoC whose part number suffix begins with “A” is an automotive-grade chip, such as CAL77S224-AE and CAL77S344-AE.

An SoC whose part number suffix begins with “I” is an industrial-grade chip, such as CAL77S244-IB and CAL60S244-IE.

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If you have any questions, please contact sales@calterah.com.